Visakhapatnam is set to host Andhra Pradesh’s first semiconductor project approved under the India Semiconductor Mission (ISM), marking a major step in the state’s efforts to enter the semiconductor manufacturing ecosystem. The project will be developed by Advanced System in Package Technologies Private Limited and will establish an Outsourced Semiconductor Assembly and Test (OSAT) facility at Tarluvada village in Anandapuram mandal.
The project involves a proposed investment of approximately ₹2,387.81 crore and will be implemented in two phases. OSAT facilities play a crucial role in the semiconductor value chain by undertaking chip assembly, packaging, and testing after wafer fabrication. The facility is expected to strengthen India’s semiconductor manufacturing capabilities while supporting the objectives of the India Semiconductor Mission.
The Andhra Pradesh government has extended significant support to the project, viewing it as a strategic investment capable of attracting additional high-technology industries to the region. Officials expect the facility to generate employment opportunities, boost industrial growth, and position Visakhapatnam as an emerging hub for advanced electronics and semiconductor manufacturing in India.
