The Union Cabinet approved manufacturing and infrastructure projects worth about ₹18,500 crore. The decisions include four semiconductor projects in Odisha, Punjab, and Andhra Pradesh, a 700 MW hydroelectric project in Arunachal Pradesh, and Phase 1B of the Lucknow Metro expansion.
With these approvals, the India Semiconductor Mission now has 10 sanctioned projects since June 2023. The four new proposals—SiCSem, Continental Device India Pvt Ltd, 3D Glass Solutions Inc., and Advanced System in Package Technologies—represent an investment of around ₹4,600 crore and will create over 2,000 skilled jobs.
SiCSem will establish a silicon carbide fabrication and packaging plant in Bhubaneswar. HIPL plans to establish an innovative glass substrate packaging facility in the same city. ASIP Technologies, in collaboration with APACT Co., Ltd of South Korea, will open a semiconductor packaging unit in Andhra Pradesh. Continental Device will expand its existing chip testing plant.
The Cabinet Committee on Economic Affairs approved ₹8,146 crore for the Tato-II Hydroelectric Project in Arunachal Pradesh, which is estimated to produce over 2,700 million units of power annually.
Lucknow’s authorised 11.16-km metro corridor will add 12 stations, bringing the network to 34 kilometres and costing ₹5,801 crore.
