Narendra Modi has virtually laid the foundation stone of the HCL-Foxconn joint venture project, India Chip Pvt. Ltd., at the Yamuna Expressway Industrial Development Authority in Jewar, Greater Noida, Uttar Pradesh. The upcoming semiconductor facility marks a major step in India’s pursuit of technological self-reliance and reinforces the Prime Minister’s vision of positioning the country as a trusted global hub for high-end electronics and chip manufacturing.
Addressing the gathering via video conferencing, Modi said the project would strengthen India’s footprint in the global semiconductor ecosystem while accelerating Uttar Pradesh’s emergence as a technology powerhouse. Emphasising that this is India’s “Tech Decade,” he noted that advances in both software and hardware will define the nation’s strength in the 21st century. Referring to the India AI Impact Summit 2026, he highlighted global recognition of India’s AI capabilities.
The Prime Minister said Made-in-India chips will power sectors such as AI, 6G, defence, and electric vehicles, forming the backbone of a Viksit Bharat. Union Minister Ashwini Vaishnaw added that electronics manufacturing has grown exponentially over the past decade, with the new Noida plant set to produce 3.6 crore chips, further boosting Uttar Pradesh’s industrial transformation.
